Electronic Packaging Needs Met by Three Dimensional Molded Interconnection Packages

871569

08/01/1987

Event
SAE Future Transportation Technology Conference and Exposition
Authors Abstract
Content
Recent developments in plating and imaging of circuit patterns on three dimensional shapes have made it possible to apply electronic circuitry directly to the surface of a molded plastic part of complex configuration. Thus both mechanical and electrical functionality can be combined in a single low cost component. The paper reviews the state of the art of this Molded Interconnection Packaging Technology, describing advantages and limitations and offering examples of specific designs.
Meta TagsDetails
DOI
https://doi.org/10.4271/871569
Pages
12
Citation
Mettler, J., Bright, J., and Impey, J., "Electronic Packaging Needs Met by Three Dimensional Molded Interconnection Packages," SAE Technical Paper 871569, 1987, https://doi.org/10.4271/871569.
Additional Details
Publisher
Published
Aug 1, 1987
Product Code
871569
Content Type
Technical Paper
Language
English