Electronic Packaging Needs Met by Three Dimensional Molded Interconnection Packages
871569
08/01/1987
- Event
- Content
- Recent developments in plating and imaging of circuit patterns on three dimensional shapes have made it possible to apply electronic circuitry directly to the surface of a molded plastic part of complex configuration. Thus both mechanical and electrical functionality can be combined in a single low cost component. The paper reviews the state of the art of this Molded Interconnection Packaging Technology, describing advantages and limitations and offering examples of specific designs.
- Pages
- 12
- Citation
- Mettler, J., Bright, J., and Impey, J., "Electronic Packaging Needs Met by Three Dimensional Molded Interconnection Packages," SAE Technical Paper 871569, 1987, https://doi.org/10.4271/871569.