DISCRETE ASSEMBLIES VS. THICK FILM IC’s

690013

02/01/1969

Event
1969 International Automotive Engineering Congress and Exposition
Authors Abstract
Content
Thick Film is an old technology that is finding new applications. Many of the future integrated circuits for the automotive industry will employ Thick Film Technology. It offers an easy transition from discrete component assemblies, while providing lower overall costs and improved reliability.
Meta TagsDetails
DOI
https://doi.org/10.4271/690013
Pages
7
Citation
HOFFMAN, E., "DISCRETE ASSEMBLIES VS. THICK FILM IC’s," SAE Technical Paper 690013, 1969, https://doi.org/10.4271/690013.
Additional Details
Publisher
Published
Feb 1, 1969
Product Code
690013
Content Type
Technical Paper
Language
English