DISCRETE ASSEMBLIES VS. THICK FILM IC’s
690013
02/01/1969
- Event
- Content
- Thick Film is an old technology that is finding new applications. Many of the future integrated circuits for the automotive industry will employ Thick Film Technology. It offers an easy transition from discrete component assemblies, while providing lower overall costs and improved reliability.
- Pages
- 7
- Citation
- HOFFMAN, E., "DISCRETE ASSEMBLIES VS. THICK FILM IC’s," SAE Technical Paper 690013, 1969, https://doi.org/10.4271/690013.