Direct Bonding of a Multi-Layer Circuit Substrate to a Heatsink

Phoenix International, the electronics manufacturing group of John Deere, has developed a product and manufacturing process to address many of the shortcomings of conventional heatsinking technologies. In this process, a thin circuit board is bonded directly to a flat surface heatsink such as a finned extrusion or liquid-cooled plate. The major benefits of the proposed solution are the simplification of the manufacturing process and substantially improved conduction of heat away from high-power circuitry.