Development of Small, High Performance Electronics Control Units with Metal Based Printed Circuit Board

In this report we focus on development of smaller and lighter ECUs for Automatic Trans-Missions (ATM).

Specifically, we describe the development of ECUs that utilize: detailed printed wire patterns, bare chip semiconductors with wire bonding technology, and many small Surface Mounting Devices (SMDs), on a metal based board with high heat dissipation.

In comparison with our current products, we have achieved:

1. (1)
   a 58% reduction in size,
2. (2)
   a 63% reduction in weight,

and an extended thermal range of operation.

These new ECUs are suited for the severe environment of the engine compartment.