THE DEVELOPMENT OF ADVANCED COOLING METHODS FOR HIGH-POWER ELECTRONICS

Potential applications for high-power electronics in the aerospace industry are increasing at a rapid rate with the development of new switch technologies for high switching power. Inherent in these trends are rapidly increasing heat fluxes and severe difficulty in minimizing silicon operating temperatures to satisfy reliability requirements. Various new technologies are presented that have been developed to meet the difficult cooling requirements of high-density power electronics equipment for the aerospace industry. These enhanced cooling techniques have also been optimized to meet the maintainability requirements of future applications.