Coupling of Transient Analysis of Thermal Flow and Thermal Stress for T Pipe

2006-01-0589

04/03/2006

Event
SAE 2006 World Congress & Exhibition
Authors Abstract
Content
Fluid Structure Interface (FSI) analyses were fast in development during recent years with the constantly advancing progress of computer technology. MpCCI (Mesh based parallel Code Coupling Interface) is a typical product of FSI. MpCCI has been developed at the Fraunhofer-Institute SCAI in order to provide an application-independent interface for the coupling of different simulation codes. Although FSI includes both flow induced displacement and thermal flow induced thermal stress, latter has received less attention.
In this paper, temperature results of a transient thermal fluid analysis in a T pipe are used as loads for a nonlinear plastic thermal stress analysis of the pipe. In the nonlinear plastic analysis, linear proximity is used for both plastic region and elastic region. That is to say, 2-line kinematicl hardening law is used to express the stress strain characteristic of the pipe. At the same time, different numbers of load are used and the results are compared.
Meta TagsDetails
DOI
https://doi.org/10.4271/2006-01-0589
Pages
10
Citation
Fan, Q., "Coupling of Transient Analysis of Thermal Flow and Thermal Stress for T Pipe," SAE Technical Paper 2006-01-0589, 2006, https://doi.org/10.4271/2006-01-0589.
Additional Details
Publisher
Published
Apr 3, 2006
Product Code
2006-01-0589
Content Type
Technical Paper
Language
English