Computer Modelling of Phenolic Postcure

870536

02/01/1987

Authors Abstract
Content
Parts made from phenolic molding materials must be postcured to promote the thorough crosslinking required for end usage at temperatures above about 175°C. Since the time and energy used in postcuring can represent about ten percent of part cost, efficient postcuring offers significant potential savings.
Based on a kinetic description of the phenolic crosslinking reaction, we have developed a computer model to predict the development of the glass transition during postcure. This model provides a convenient CAD tool for minimizing postcuring costs.
Meta TagsDetails
DOI
https://doi.org/10.4271/870536
Pages
8
Citation
Arimond, J., Fitts, B., and Landi, V., "Computer Modelling of Phenolic Postcure," SAE Technical Paper 870536, 1987, https://doi.org/10.4271/870536.
Additional Details
Publisher
Published
Feb 1, 1987
Product Code
870536
Content Type
Technical Paper
Language
English