Smart Junction Box (SJB) assemblies play an important role in bringing together power distribution and electronic system control within an integrated module to reduce cost, complexity and weight. The combination of through-hole and SMT components and high-power in the same assembly poses special challenges. High current levels for power distribution in SJBs often necessitate heavy copper layers. These layers can act as unintended heat-sinks within multi-layer PCBs, making it difficult to solder through-hole interconnects using conventional pin-through-paste and reflow solder methodologies. The result yields difficult process control, more rework and higher production costs.
In contrast, compliant interconnects can be inserted directly into the PCB to form a completed connection without a subsequent wave or reflow solder processing step, thereby eliminating the complexities and issues associated with soldering.
Using the proven eye-of-the-needle design approach, today’s compliant technology products have been designed and tested to meet the requirements of USCAR specifications, and will operate under stringent vehicular environmental conditions in double-sided as well as multi-layer printed circuit boards.
This presentation and paper provides specific design details on the use of compliant interconnect technologies for the creation of Smart Junction Box assemblies. It also provides details on the testing processes used to certify compliant terminals to SAE/USCAR and other applicable standards.