Comparing Substrate Solutions for Automotive Power Electronics Applications

2004-01-1681

03/08/2004

Event
SAE 2004 World Congress & Exhibition
Authors Abstract
Content
High power electronic applications in the automotive industry require interconnecting substrates that have high reliability, high thermal conductivity, high current capability, multi-layer potential, and small size. This paper addresses the design requirements for automotive power substrates and how ever increasing demands are challenging the current substrate technology. Four different substrate material types, with various design features, capable of meeting these stringent requirements are described. Thermal impedance testing of each substrate along with design variations to enhance thermal capability was completed. The results of the thermal testing are compared based on appropriate application of the substrate technology.
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DOI
https://doi.org/10.4271/2004-01-1681
Pages
9
Citation
Fairchild, M., Myers, J., Badgett, J., Berlin, C. et al., "Comparing Substrate Solutions for Automotive Power Electronics Applications," SAE Technical Paper 2004-01-1681, 2004, https://doi.org/10.4271/2004-01-1681.
Additional Details
Publisher
Published
Mar 8, 2004
Product Code
2004-01-1681
Content Type
Technical Paper
Language
English