Chip-in-Glass FIP's (Fluorescent Indicator Panel) for Automotive Applications

870209

02/01/1987

Event
SAE International Congress and Exposition
Authors Abstract
Content
This paper describes the latest Fluorescent Indicator Panel (FIP) technology, featuring integrated circuits mounted within the vacuum envelope on the glass substrate. This is called Chip-in-Glass FIP, or CIG FIP. The discussion includes basic technologies, design flexibility, reliability, and driver ICs.
Meta TagsDetails
DOI
https://doi.org/10.4271/870209
Pages
8
Citation
Yoshida, Y., and Ishizuka, A., "Chip-in-Glass FIP's (Fluorescent Indicator Panel) for Automotive Applications," SAE Technical Paper 870209, 1987, https://doi.org/10.4271/870209.
Additional Details
Publisher
Published
Feb 1, 1987
Product Code
870209
Content Type
Technical Paper
Language
English