Chip-in-Glass FIP's (Fluorescent Indicator Panel) for Automotive Applications

870209

2/1/1987

Authors
Abstract
Content
This paper describes the latest Fluorescent Indicator Panel (FIP) technology, featuring integrated circuits mounted within the vacuum envelope on the glass substrate. This is called Chip-in-Glass FIP, or CIG FIP. The discussion includes basic technologies, design flexibility, reliability, and driver ICs.
Meta TagsDetails
DOI
https://doi.org/10.4271/870209
Citation
Yoshida, Y. and Ishizuka, A., "Chip-in-Glass FIP's (Fluorescent Indicator Panel) for Automotive Applications," SAE International Congress and Exposition, Detroit, Michigan, United States, February 23, 1987, https://doi.org/10.4271/870209.
Additional Details
Publisher
Published
2/1/1987
Product Code
870209
Content Type
Technical Paper
Language
English