870209: Chip-in-Glass FIP's (Fluorescent Indicator Panel) for Automotive Applications - Technical Paper

Event: SAE International Congress and Exposition

Authors

Yukitoshi Yoshida

Abstract

Content: This paper describes the latest Fluorescent Indicator Panel (FIP) technology, featuring integrated circuits mounted within the vacuum envelope on the glass substrate. This is called Chip-in-Glass FIP, or CIG FIP. The discussion includes basic technologies, design flexibility, reliability, and driver ICs.

Meta Tags

Topics: Integrated circuits
Vehicle drivers
Reliability
Vacuum
Glass

Affiliated or Co-Author: NEC Corp.

Details

DOI: https://doi.org/10.4271/870209

Pages: 8

Citation: Yoshida, Y., and Ishizuka, A., "Chip-in-Glass FIP's (Fluorescent Indicator Panel) for Automotive Applications," SAE Technical Paper 870209, 1987, https://doi.org/10.4271/870209.

Additional Details

Publisher: SAE International

Published: Feb 1, 1987

Product Code: 870209

Content Type: Technical Paper

Language: English