Board Level Reliability of Ceramic CSP in Harsh Temperature Cycling Test Condition

This study is concentrate on IC packaging technology that utilizes ceramic as the material carrier of Chip Scale Package (CSP) for automotive applications. For the CSP mounting on organic PWB, Thermal Coefficient of Expansion (TCE) and Young's modulus of components, solder joint and temperature cycling condition affect to the reliability. In this study, Ceramic CSP was subjected to -40/+150 degree C temperature cycling test condition that is typical automotive requirement for harsh thermal circumstances. Varieties of test matrix were prepared. Flip chip and wire bonding options for die-carrier interconnection, different board materials and different solder joint structure on CSP were also evaluated as a part of the matrix. The result of evaluation was analyzed by statistics, cross sectional observation and Finite Element Method (FEM). The reliability of ceramic CSP on high Tg FR-4 and alumina ceramic board with underfiill was quite satisfactory.