Automotive Amplifier Heatsink Design and Thermal Analysis Research at Transient State Condition

2009-01-3077

10/01/2009

Event
Thermal System Efficiencies Summit
Authors Abstract
Content
The thermal design requirements at transient state condition are becoming progressively more common in automotive electronic products specifications. For studying the characteristics of heatsink design and CFD thermal analysis in transient state environment, the theories about heat transfer at transient state condition are researched. Some key factors heavily affecting the thermal performance of heatsink are discussed, such as the thickness of heatsink base, the processes of heatsink surfaces and the intervals definitions of whole computation duration in transient state thermal simulation. Then some conclusions of those factors are summarized. Lastly, for an automotive amplifier heatsink design as example, those conclusions are studied and described further based on the correlation of test and analysis results.
Meta TagsDetails
DOI
https://doi.org/10.4271/2009-01-3077
Pages
6
Citation
Wang, C., and Liao, F., "Automotive Amplifier Heatsink Design and Thermal Analysis Research at Transient State Condition," SAE Technical Paper 2009-01-3077, 2009, https://doi.org/10.4271/2009-01-3077.
Additional Details
Publisher
Published
Oct 1, 2009
Product Code
2009-01-3077
Content Type
Technical Paper
Language
English