Analysis of Degradation Mechanism of Lead-Free Materials

2009-01-0260

04/20/2009

Event
SAE World Congress & Exhibition
Authors Abstract
Content
The use of lead-free (Pb-free) solder and plating in onboard electronic components has accelerated rapidly in recent years, but solutions have yet to be found for the issues of whisker generation in tin (Sn) plating and crack initiation in Pb-free solder, despite widespread research efforts. Analysis of the whisker generation mechanism has focused on internal energy levels and crystal orientation, and analysis of the crack initiation mechanism in Pb-free solder has examined changes in the grain boundaries of Sn crystals.
Meta TagsDetails
DOI
https://doi.org/10.4271/2009-01-0260
Pages
6
Citation
Nomura, T., Shibata, Y., Sakano, M., and Konda, S., "Analysis of Degradation Mechanism of Lead-Free Materials," SAE Technical Paper 2009-01-0260, 2009, https://doi.org/10.4271/2009-01-0260.
Additional Details
Publisher
Published
Apr 20, 2009
Product Code
2009-01-0260
Content Type
Technical Paper
Language
English