A Stress Relief Method Based on a Hybrid Process of Shot Peening and Laser Directed Energy Deposition with the Same Materials

2026-99-0232

To be published on 07/31/2026

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Abstract
Content
Laser directed energy deposition (LDED) is widely used in various fields due to its fine forming structure and superior performance. However, the characteristics of the hot forming process result in significant residual tensile stress in the formed materials, which affects the capability and useful life of the mechanism accessory. The hybrid manufacturing technology of shot peening (SP) and LDED has a significant influence on the elimination of defects and the improvement in microstructure of formed materials and reducing residual stress, but it also has limitations. To solve the problems, such as the introduction of powders and the difficulty in recycling and classification when using heterogeneous materials for shot peening in hybrid processes, this paper proposes a method of strengthening with the same material, establishes a thermal shot peening simulation model for the hybrid process, and conducts experimental verification. The research finds that the average generated stress of SP in hybrid manufacturing technology is -215.6 MPa, and the thickness of the strengthening layer is about 40 μm. The subsequent hot forming process will eliminate part of the induced stress by SP on the previous deposition, but the deposited stress on the surface is reduced compared with that in the single process. The hybrid manufacturing technology of SP and LDED, based on the same material, effectively utilizes the residual heat from the forming process, providing feasibility for engineering applications.
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Citation
Zhang, X., Zhang, M., Li, D., Jiang, Y., et al., "A Stress Relief Method Based on a Hybrid Process of Shot Peening and Laser Directed Energy Deposition with the Same Materials," The 10th International Conference on Mechanical Manufacturing Technology and Material Engineering (MMTME 2025), Shenyang, China, September 19, 2025, .
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Publisher
Published
To be published on Jul 31, 2026
Product Code
2026-99-0232
Content Type
Technical Paper
Language
English