A Packaging Layout to Mitigate Crosstalk for SiC Devices

2018-01-0462

04/03/2018

Event
WCX World Congress Experience
Authors Abstract
Content
SiC devices have inherent fast switching capabilities due to their superior material properties, and are considered potential candidates to replace Si devices for traction inverters in electrified vehicles in future. However, due to the comparatively low gate threshold voltage, SiC devices may encounter oscillatory false triggering especially during fast switching. This paper analyzed the causes of false triggering, and also studied the impact of a critical parasitic parameter - common source inductance. It is shown that crosstalk is the main cause for the false triggering in the case and some positive common source inductance help to mitigate the crosstalk issue. A packaging layout method is proposed to create the positive common source inductance through layout of control terminals / busbars, and/or the use of control terminal bonded wires at different height.
Meta TagsDetails
DOI
https://doi.org/10.4271/2018-01-0462
Pages
5
Citation
Xu, Z., Chen, C., and Lei, T., "A Packaging Layout to Mitigate Crosstalk for SiC Devices," SAE Technical Paper 2018-01-0462, 2018, https://doi.org/10.4271/2018-01-0462.
Additional Details
Publisher
Published
Apr 3, 2018
Product Code
2018-01-0462
Content Type
Technical Paper
Language
English