Automotive
Technical Paper

3D- ESPI: Thermal Expansion Analysis of Electronic Components

2006-01-0765

4/3/2006

Event
SAE 2006 World Congress & Exhibition
Authors
H. Schubach Dantec Dynamics GmbH
E. Moser Dantec Dynamics GmbH
Abstract
Content
Meta Tags
Topics
Electronic equipment
Analysis methodologies
Affiliated or Co-Author
Dantec Dynamics GmbH
Details
DOI
https://doi.org/10.4271/2006-01-0765
Citation
Schubach, H. and Moser, E., "3D- ESPI: Thermal Expansion Analysis of Electronic Components," SAE 2006 World Congress & Exhibition, Detroit, Michigan, United States, April 3, 2006, https://doi.org/10.4271/2006-01-0765.
Additional Details
Publisher
SAE International
Published
4/3/2006
Product Code
2006-01-0765
Content Type
Technical Paper
Language
English