Laser Structuring of 3D Circuits and Antennas

The LPKF Fusion3D 1000 can be used for MID manufacturing of small and medium volumes or for prototyping. The laser structure lowers the price threshold for entering the 3D interconnect device market. Components are produced from plastic with additives for laser direct structuring. The laser structures the surface and roughens it, activating the additive. Rotating the component and tracking the laser focus during the machining process adds true three-dimensionality. First copper is deposited on the activated structures in a current-free metallization process.