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Requirements for Using Solder Dip to Replace the Finish on Electronic Piece Parts
- Aerospace Standard
- GEIASTD0006
- Issued
Downloadable datasets available
Annotation ability available
Sector:
Issuing Committee:
Language:
English
Scope
This standard defines the requirements for fully replacing undesirable surface finishes using solder dip. Requirements for qualifying and testing the refinished piece parts are also included. This standard covers the replacement of pure tin and Pb-free tin alloy finishes with SnPb finishes. This dipping is different from dipping to within some distance of the body for the purposes of solderability; solder dipping for purposes other than full replacement of pure tin and other Pb-free tin alloy finishes are beyond the scope of this document. It covers process and testing requirements for robotic and semi-automatic dipping process but does not cover purely manual dipping processes, due to the lack of understanding of the appropriate requirements for hand-dipping for tin whisker mitigation at this time.
This standard does not apply to piece-part manufacturers who build piece parts with a hot solder dip finish. It applies to refinishing performed by any other group, including a third party supplier, production facilities at the supplier and other organizations, whenever the intent of the dipping is to have full coverage and replacement of Pb-free tin.
The intent of this standard is for suppliers and users to incorporate these requirements into their operations to provide a consistent and well-controlled process for product applications that require significant control, typically Control Levels 2C or 3 of GEIA-STD-0005-2. Each user shall determine the applicability of this standard and the need for full replacement of the existing termination finish. This standard does not guarantee a particular yield or reliability of piece parts going through solder dipping. Some applications may have unique requirements that exceed the scope of this standard, and should be specified separately.
Pb-free tin piece parts which have been dipped in compliance with this standard are no longer considered to be Pb-free tin finished for the purposes of GEIA-STD-0005-2.
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Topic
Data Sets - Support Documents
| Title | Description | Download |
|---|---|---|
| Unnamed Dataset 1 | ||
| Unnamed Dataset 2 | ||
| Unnamed Dataset 3 | ||
| Table 1 | Piece Part Categories | |
| Table 2 | Required Process Flow for Solder Dip Qualification | |
| Table 3 | Additional Qualification Requirements for Processes 1A and 2A | |
| Table 4 | Test Method Requirements for Robotic Dip During Production Robotic Solder Dip | |
| Table 5 | Test Method Requirements for Semi-automatic Dip During Production Solder Dip | |
| Unnamed Dataset 9 | ||
| Unnamed Dataset 10 |
Issuing Committee
G-24 Pb-free Risk Management Committee for ADHP
Pb-free Risk Management Committee for ADHP Committee develops standards and specifications for Pb-free electronics risk management for the aerospace, defense and high performance electronics industries. The committee also provides input to government and other industry standards related to Pb-free electronics risk management. It does not develop or revise workmanship and manufacturing standards.
Reference
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