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Use of Pb-Free Ball Grid Array Component Soldered Using SnPb Solder
- Aerospace Standard
- ARP6415
- Issued
Downloadable datasets available
Annotation ability available
Sector:
Issuing Committee:
Language:
English
Scope
This document contains information and guidance on the use of Pb-free ball grid arrays (BGAs) in an aerospace, defense, and high performance (ADHP) product, or other products which demand a high reliability.
Rationale
Aerospace, defense, and high performance (ADHP) manufacturers have avoided a transition to Pb-free for most products, but the limited availability of ball grid array packages with SnPb alloy solder balls has driven the use of parts with Pb-free solder balls. There have been numerous studies on the use of the Pb-free parts in a SnPb assembly, and this document provides a consolidated summary of the industry best practices and issues related to use of these Pb-free parts.
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Topic
Data Sets - Support Documents
Title | Description | Download |
---|---|---|
Unnamed Dataset 1 | ||
Unnamed Dataset 2 | ||
Table 1 | Advantages and disadvantages of methods to address Pb-free BGAs | |
Table 2 | Risks associated with product use environment and methods to address Pb-free BGAs | |
Table 3 | Comparison of cost considerations associated with methods to address Pb-free BGAs |
Issuing Committee
G-24 Pb-free Risk Management Committee for ADHP
Pb-free Risk Management Committee for ADHP Committee develops standards and specifications for Pb-free electronics risk management for the aerospace, defense and high performance electronics industries. The committee also provides input to government and other industry standards related to Pb-free electronics risk management. It does not develop or revise workmanship and manufacturing standards.
Reference
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