AIR1141: 1992 Report on Flip Chip and Beam Lead Bonding for Electronic Circuits - Information Report

Issuing Committee: AE-7P Protective and Control Devices

Scope

Content: No Scope available

Details

DOI: https://doi.org/10.4271/AIR1141

Pages: 21

Citation: SAE International Information Report, 1992 Report on Flip Chip and Beam Lead Bonding for Electronic Circuits, SAE Standard AIR1141, Cancelled December 1971, https://doi.org/10.4271/AIR1141.

Additional Details

Publisher: SAE International

Published: Dec 1, 1971

Product Code: AIR1141

Content Type: Information Report

Status: Canceled

Language: English