High Strength versus Stress Relief In a Structural Bond

710108

2/1/1971

Authors
Abstract
Content
In bonding two materials differing in coefficient of expansion, one must either contain the stresses due to temperature cycling using a rigid adhesive, or allow the two adherends to expand and contract freely using an elastomeric adhesive. An experiment is described which demonstrates the extent that stresses can be contained when a rigid adhesive is used to bond materials of greatly different coefficients of expansion.
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DOI
https://doi.org/10.4271/710108
Citation
DeLollis, N., "High Strength versus Stress Relief In a Structural Bond," 1971 Automotive Engineering Congress and Exposition, Detroit, Michigan, United States, January 11, 1971, https://doi.org/10.4271/710108.
Additional Details
Publisher
Published
2/1/1971
Product Code
710108
Content Type
Technical Paper
Language
English