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High Strength versus Stress Relief In a Structural Bond
ISSN: 0148-7191, e-ISSN: 2688-3627
Published February 01, 1971 by SAE International in United States
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In bonding two materials differing in coefficient of expansion, one must either contain the stresses due to temperature cycling using a rigid adhesive, or allow the two adherends to expand and contract freely using an elastomeric adhesive. An experiment is described which demonstrates the extent that stresses can be contained when a rigid adhesive is used to bond materials of greatly different coefficients of expansion.