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Board Level Reliability of Ceramic CSP in Harsh Temperature Cycling Test Condition
Technical Paper
2001-01-0692
ISSN: 0148-7191, e-ISSN: 2688-3627
Annotation ability available
Sector:
Event:
SAE 2001 World Congress
Language:
English
Abstract
This study is concentrate on IC packaging technology that utilizes ceramic as the material carrier of Chip Scale Package (CSP) for automotive applications. For the CSP mounting on organic PWB, Thermal Coefficient of Expansion (TCE) and Young's modulus of components, solder joint and temperature cycling condition affect to the reliability. In this study, Ceramic CSP was subjected to -40/+150 degree C temperature cycling test condition that is typical automotive requirement for harsh thermal circumstances. Varieties of test matrix were prepared. Flip chip and wire bonding options for die-carrier interconnection, different board materials and different solder joint structure on CSP were also evaluated as a part of the matrix. The result of evaluation was analyzed by statistics, cross sectional observation and Finite Element Method (FEM). The reliability of ceramic CSP on high Tg FR-4 and alumina ceramic board with underfiill was quite satisfactory.
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Authors
- Shoji Uegaki - Semiconductor Components R&D, Kyocera Corp.
- Seigo Matsuzono - Semiconductor Components R&D, Kyocera Corp.
- Singo Sato - Semiconductor Components R&D, Kyocera Corp.
- Shin Matsuda - Semiconductor Components R&D, Kyocera Corp.
- Hiroshi Matsumoto - Semiconductor Components R&D, Kyocera Corp.
Citation
Uegaki, S., Matsuzono, S., Sato, S., Matsuda, S. et al., "Board Level Reliability of Ceramic CSP in Harsh Temperature Cycling Test Condition," SAE Technical Paper 2001-01-0692, 2001, https://doi.org/10.4271/2001-01-0692.Also In
SAE 2001 Transactions Journal of Passenger Cars - Electronic and Electrical Systems
Number: V110-7; Published: 2002-09-15
Number: V110-7; Published: 2002-09-15
References
- Tanahashi Shigeo Uegaki Shoji Takeda Shigeto Fukui Masahiro ‘Ceramic CSP-The Characteristics and The Advantages’ IEEE workshop on VLSI and Micro System Packaging Technique and Manufacturing Technologies Burgee, Belgium 4-5 May 1998
- Uegaki Shoji Matsuzono Seigo Sato Shingo Kubota Takeshi Fukui Masahiro ‘Ceramic CSP-Current Status of Technology’ Surface Mount International Conference & Exposition San Jose, California, USA 23-27 August 1998 179 198
- Takeda Shigeto Kabumoto Masanao Fukui Masahiro ‘Ceramic CSP-The Characteristics and the Advantages’ The 31 st International Symposium on Microelectronics IMAPS '98 San Diego, California, USA 31 October 4 November 1998
- Uegaki Shoji Matsuzono Seigo Sato Shingo Kubota Takeshi Matsuda Shin Fukui Masahiro ‘Development of Array Format Ceramic CSP’ 1999 Fourth Annual Pan Pacific Microelectronics Symposium’ Kauai, Hawaii, USA 2-5 February 1999 26 31
- Matsuzono Seigo Kubota Takeshi Sato Shingo Matsuda Shin Uegaki Shoji ‘Development of Ceramic CSP-Array Format Carrier and Assembly Technology’ The 3 rd 1999 IEMT/IMC SYMPOSIUM 21-23 April 1999 Sonic City, Oomiya, Saitama, Japan 18 23
- Matsuzono Seigo Kubota Takeshi Sato Shingo Matsuda Shin Basho Yoshihiro Uegaki Shoji ‘Broadening the Ceramic CSP Market for Higher Reliability Applications’ 1999 SMTA International San Jose, California, USA 14-16 September 1999 128 131
- Uegaki Shoji Matsuzono Seigo Sato Shingo Kubota Takeshi Basho Yoshihiro Matsuda Shin ‘Ceramic CSP Technology for High Reliability Demanded Market’ APACK '99 Singapore 8-10 December 1999 106 113