Magazine Article

Wafer-Level Membrane-Transfer Process for Fabricating MEMS

TBMG-973

1/1/2003

Abstract
Content

A process for transferring an entire wafer-level micromachined silicon structure for mating with and bonding to another such structure has been devised. This process is intended especially for use in wafer-level integration of microelectro- mechanical systems (MEMS) that have been fabricated on dissimilar substrates.

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Citation
"Wafer-Level Membrane-Transfer Process for Fabricating MEMS," Mobility Engineering, January 1, 2003.
Additional Details
Publisher
Published
1/1/2003
Product Code
TBMG-973
Content Type
Magazine Article
Language
English