Wafer-Level Membrane-Transfer Process for Fabricating MEMS
TBMG-973
1/1/2003
- Content
A process for transferring an entire wafer-level micromachined silicon structure for mating with and bonding to another such structure has been devised. This process is intended especially for use in wafer-level integration of microelectro- mechanical systems (MEMS) that have been fabricated on dissimilar substrates.
- Citation
- "Wafer-Level Membrane-Transfer Process for Fabricating MEMS," Mobility Engineering, January 1, 2003.