Magazine Article

Wafer Level Camera Technology

TBMG-10971

07/01/2009

Abstract
Content

Film cameras were traditionally manufactured by discrete assembly, which means each component was fabricated as an individual item, tested if necessary, and then assembled into the final working product. The advent of solid state imaging did little to change this approach. The film was merely replaced by a light-sensitive electronic component. The only significant change was that the mechanical shutter was rendered obsolete and its action generated electronically within the imager die.

Meta TagsDetails
Citation
"Wafer Level Camera Technology," Mobility Engineering, July 1, 2009.
Additional Details
Publisher
Published
Jul 1, 2009
Product Code
TBMG-10971
Content Type
Magazine Article
Language
English