Using Open-Cavity Plastic Packages in Avionics Applications

Semiconductor makers invest significant resources in the development and manufacture of their devices, including packaging and assembly techniques that accommodate their material, mechanical, electrical, reliability, and footprint specifications. They must meet very tight time-to-market windows as cost-effectively as possible.

Fast-turn prototype package assembly is frequently employed for rapid IC design verification. Open-cavity plastic packages (OCPP) are an attractive quick-turn assembly option when commercial off-the-shelf (COTS) prototype packages are not available. QP Technologies can convert any existing IC plastic packages, whether dummies, electrical test rejects or excess inventory, into open-cavity packages, ready to be assembled with new die. By converting a range of popular package types, sizes and pin counts, new packages can be created that will fit an established footprint. This allows them to be easily inserted into test sockets and boards, so that no retooling or redesign is required.