Using Diffusion Bonding in Making Piezoelectric Actuators

TBMG-1403

5/1/2003

Abstract
Content

A technique for the fabrication of piezoelectric actuators that generate acceptably large forces and deflections at relatively low applied voltages involves the stacking and diffusion bonding of multiple thin piezoelectric layers coated with film electrodes. The present technique stands in contrast to an older technique in which the layers are bonded chemically, by use of urethane or epoxy agents.

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Citation
"Using Diffusion Bonding in Making Piezoelectric Actuators," Mobility Engineering, May 1, 2003.
Additional Details
Publisher
Published
5/1/2003
Product Code
TBMG-1403
Content Type
Magazine Article
Language
English