Using Diffusion Bonding in Making Piezoelectric Actuators
TBMG-1403
5/1/2003
- Content
A technique for the fabrication of piezoelectric actuators that generate acceptably large forces and deflections at relatively low applied voltages involves the stacking and diffusion bonding of multiple thin piezoelectric layers coated with film electrodes. The present technique stands in contrast to an older technique in which the layers are bonded chemically, by use of urethane or epoxy agents.
- Citation
- "Using Diffusion Bonding in Making Piezoelectric Actuators," Mobility Engineering, May 1, 2003.