Magazine Article

Update on Development of SiC Multi-Chip Power Modules

TBMG-3421

12/01/2008

Abstract
Content

Progress has been made in a continuing effort to develop multi-chip power modules (SiC MCPMs). This effort at an earlier stage was reported in “SiC Multi-Chip Power Modules as Power-System Building Blocks” (LEW-18008-1), NASA Tech Briefs, Vol. 31, No. 2 (February 2007), page 28.

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Citation
"Update on Development of SiC Multi-Chip Power Modules," Mobility Engineering, December 1, 2008.
Additional Details
Publisher
Published
Dec 1, 2008
Product Code
TBMG-3421
Content Type
Magazine Article
Language
English