Trustworthy Hardware for 3D Circuit-Level Integration

TBMG-11452

10/01/2011

Abstract
Content

Three-dimensional (3D) integration is a promising technology for designing high-performance, low-power systems by stacking multiple integrated circuit dies and connecting them at the circuit level with conductive posts. Most current efforts are at the electromechanical level of getting 3D to work efficiently and cost effectively.

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Citation
"Trustworthy Hardware for 3D Circuit-Level Integration," Mobility Engineering, October 1, 2011.
Additional Details
Publisher
Published
Oct 1, 2011
Product Code
TBMG-11452
Content Type
Magazine Article
Language
English