Magazine Article

Thermally Conductive Adhesives Bring Specialized Solutions to Complex Design Challenges

TBMG-23333

11/01/2015

Abstract
Content

Thermally conductive adhesives are uniquely qualified to meet the increasingly diverse requirements of advanced electronics systems. From their traditional use as fastening materials, adhesives find wide application in bonding and encapsulation in nearly every application segment, including military/aerospace, medical, automotive, and industrial, among others. In their traditional application in computer and communications systems, thermally conductive adhesives have long played a vital role at the chip level for die attach, at the PCB level for heat sink bonding, and at both the chip and board levels for all types of thermal management methods.

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Citation
"Thermally Conductive Adhesives Bring Specialized Solutions to Complex Design Challenges," Mobility Engineering, November 1, 2015.
Additional Details
Publisher
Published
Nov 1, 2015
Product Code
TBMG-23333
Content Type
Magazine Article
Language
English