Thermal Comparison of FR4 and IMS PCB Technology for Power Electronics Applications: Case Study for Automotive Industry.
SAE-PP-00305
10/28/2022
- Content
- The electrification megatrend in the automotive industry relies heavily on power semiconductor devices for converter and inverter realization. The stringent weight and size reduction targets prescribed by vehicle manufacturers often results in excessive thermal stresses on power semiconductors leading to failures. These failures can be controlled by systematic thermal management strategies including proper PCB designing. This paper focuses on modeling of different PCB technologies i.e., FR4 and IMS PCB in RC model and comparing its performance. Thermal performance is the ability to efficiently transfer heat to the ambient from the heat source like power semiconductor devices (MOSFET, IGBT, Diodes), it plays a crucial role in determining the reliability and size of power electronics systems. This paper compares the thermal performance of FR4 PCB and Insulated Metal Substrate (IMS) PCB, one dimensional analysis is performed to analyses the thermal performance; the calculations results is simulated in Spice model and results is compared.
- Citation
- PATIL, D., "Thermal Comparison of FR4 and IMS PCB Technology for Power Electronics Applications: Case Study for Automotive Industry.," SAE MobilityRxiv™ Preprint, submitted October 28, 2022, https://doi.org/10.47953/SAE-PP-00305.