Terahertz Mapping of Microstructure and Thickness Variations

TBMG-6575

01/01/2010

Abstract
Content

A noncontact method has been devised for mapping or imaging spatial variations in the thickness and microstructure of a layer of a dielectric material. The method involves (1) placement of the dielectric material on a metal substrate, (2) through-the-thickness pulse-echo measurements by use of electromagnetic waves in the terahertz frequency range with a raster scan in a plane parallel to the substrate surface that do not require coupling of any kind, and (3) appropriate processing of the digitized measurement data.

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Citation
"Terahertz Mapping of Microstructure and Thickness Variations," Mobility Engineering, January 1, 2010.
Additional Details
Publisher
Published
Jan 1, 2010
Product Code
TBMG-6575
Content Type
Magazine Article
Language
English