Magazine Article

Surviving The Embedded Design Thermo-Mechanical Envelope

TBMG-11454

10/01/2011

Abstract
Content

The Embedded usage model is characterized as one that is operated at the extremes of available performance. Knowing that the targets of the thermal design power usage mode are only partially applicable, embedded designers must satisfy the customers’ innate desires for maximum throughput and level of service at the edges of a constrained thermo- mechanical environment.

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Citation
"Surviving The Embedded Design Thermo-Mechanical Envelope," Mobility Engineering, October 1, 2011.
Additional Details
Publisher
Published
Oct 1, 2011
Product Code
TBMG-11454
Content Type
Magazine Article
Language
English