Magazine Article

Submillimeter-Wave Amplifier Module With Integrated Waveguide Transitions

TBMG-3485

01/01/2009

Abstract
Content

To increase the usefulness of monolithic millimeter-wave integrated circuit (MMIC) components at submillimeter-wave frequencies, a chip has been designed that incorporates two integrated, radial E-plane probes with an MMIC amplifier in between, thus creating a fully integrated waveguide module. The integrated amplifier chip has been fabricated in 35-nm gate length InP high-electron-mobility-transistor (HEMT) technology. The radial probes were mated to grounded coplanar waveguide input and output lines in the internal amplifier. The total length of the internal HEMT amplifier is 550 μm, while the total integrated chip length is 1,085 μm. The chip thickness is 50 μm with the chip width being 320 μm.

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Citation
"Submillimeter-Wave Amplifier Module With Integrated Waveguide Transitions," Mobility Engineering, January 1, 2009.
Additional Details
Publisher
Published
Jan 1, 2009
Product Code
TBMG-3485
Content Type
Magazine Article
Language
English