Magazine Article

Stripline/Microstrip Transition in Multilayer Circuit Board

TBMG-228

08/01/2005

Abstract
Content

A stripline to microstrip transition has been incorporated into a multilayer circuit board that supports a distributed solid-state microwave power amplifier, for the purpose of coupling the microwave signal from a buried-layer stripline to a top-layer microstrip. The design of the transition could be adapted to multilayer circuit boards in such products as cellular telephones (for connecting between circuit-board signal lines and antennas), transmitters for Earth/satellite communication systems, and computer mother boards (if processor speeds increase into the range of tens of gigahertz).

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Citation
"Stripline/Microstrip Transition in Multilayer Circuit Board," Mobility Engineering, August 1, 2005.
Additional Details
Publisher
Published
Aug 1, 2005
Product Code
TBMG-228
Content Type
Magazine Article
Language
English