Magazine Article

Silicon Wafer-Scale Substrate for Microshutters and Detector Arrays

TBMG-5633

09/01/2009

Abstract
Content

The silicon substrate carrier was created so that a large-area array (in this case 62,000+ elements of a microshutter array) and a variety of discrete passive and active devices could be mounted on a single board, similar to a printed circuit board. However, the density and number of interconnects far exceeds the capabilities of printed circuit board technology. To overcome this hurdle, a method was developed to fabricate this carrier out of silicon and implement silicon integrated circuit (IC) technology. This method achieves a large number of high-density metal interconnects; a 100-percent yield over a 6-in. (≈15-cm) diameter wafer (one unit per wafer); a rigid, thermally compatible structure (all components and operating conditions) to cryogenic temperatures; re-workability and component replaceability, if required; and the ability to precisely cut large-area holes through the substrate.

Meta TagsDetails
Citation
"Silicon Wafer-Scale Substrate for Microshutters and Detector Arrays," Mobility Engineering, September 1, 2009.
Additional Details
Publisher
Published
Sep 1, 2009
Product Code
TBMG-5633
Content Type
Magazine Article
Language
English