Magazine Article

SiC Multi-Chip Power Modules as Power-System Building Blocks

TBMG-1173

02/01/2007

Abstract
Content

The term “SiC MCPMs” (wherein “MCPM” signifies “multi-chip power module”) denotes electronic power-supply modules containing multiple silicon carbide power devices and silicon-on-insulator (SOI) control integrated-circuit chips. SiC MCPMs are being developed as building blocks of advanced expandable, reconfigurable, fault-tolerant power-supply systems. Exploiting the ability of SiC semiconductor devices to operate at temperatures, breakdown voltages, and current densities significantly greater than those of conventional Si devices, the designs of SiC MCPMs and of systems comprising multiple SiC MCPMs are expected to afford a greater degree of miniaturization through stacking of modules with reduced requirements for heat sinking. Moreover, the higher-temperature capabilities of SiC MCPMs could enable operation in environments hotter than Si-based power systems can withstand.

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Citation
"SiC Multi-Chip Power Modules as Power-System Building Blocks," Mobility Engineering, February 1, 2007.
Additional Details
Publisher
Published
Feb 1, 2007
Product Code
TBMG-1173
Content Type
Magazine Article
Language
English