Radiation-Tolerant Intelligent Memory Stack — RTIMS

This innovation provides reconfigurable circuitry and 2-Gb of error-corrected or 1-Gb of triple-redundant digital memory in a small package. RTIMS uses circuit stacking of heterogeneous components and radiation shielding technologies. A reprogrammable field-programmable gate array (FPGA), six synchronous dynamic random access memories, linear regulator, and the radiation mitigation circuits are stacked into a module of 42.7×42.7×13 mm. Triple module redundancy, current limiting, configuration scrubbing, and single-event function interrupt detection are employed to mitigate radiation effects. The novel self-scrubbing and single event functional interrupt (SEFI) detection allows a relatively “soft” FPGA to become radiation tolerant without external scrubbing and monitoring hardware.