Q&A

24AUTP04_14

4/1/2024

Authors
Abstract
Content

Owl AI has steadily been improving the SWaP-C (Size, Weight, Power and Cost) of the electronics in its thermal camera sensors while also improving capability. The company's latest units have three-and-a-half times more pixel density in roughly the same size silicon area, as well as additional logic in the chip that now uses a single board versus the three-board stack used previously. We spoke with Owl AI CEO and co-founder Chuck Gershman about this improvement and how it's opening up new doors for his company. This is an edited transcript of our discussion.

Meta TagsDetails
Citation
Blanco, S., "Q&A," Mobility Engineering, April 1, 2024.
Additional Details
Publisher
Published
4/1/2024
Product Code
24AUTP04_14
Content Type
Magazine Article
Language
English