Precision in Miniature: New Microgripper Technology for Electronics and Assembly

TBMG-53171

05/01/2025

Abstract
Content

Researchers at the Beijing Institute of Technology have unveiled an innovative electrothermal microgripper that promises to improve microelectronics, biomedical engineering, and MEMS applications. With its remarkable deformation capabilities, excellent size compatibility and reliable catch strength, the microgripper enables the manipulation and assembly of micro- and nano-scale objects with exceptional efficiency. This technological advancement is poised to enhance microscale engineering and pave the way for innovations across various high-tech industries.

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Citation
"Precision in Miniature: New Microgripper Technology for Electronics and Assembly," Mobility Engineering, May 1, 2025.
Additional Details
Publisher
Published
May 01
Product Code
TBMG-53171
Content Type
Magazine Article
Language
English