Polymer-Based Electrical Insulation for Circuits

TBMG-39261

06/01/2021

Abstract
Content

All of our most-used electronic devices rely on increasingly smaller microchips. One of the biggest hurdles to putting more circuits and power onto a smaller chip is managing the heat. As chips become smaller, heat increases exponentially. Not only are there more transistors in a given area — which generates more heat in a small space — but they also are closer together, making it harder for heat to dissipate.

Meta TagsDetails
Citation
"Polymer-Based Electrical Insulation for Circuits," Mobility Engineering, June 1, 2021.
Additional Details
Publisher
Published
Jun 1, 2021
Product Code
TBMG-39261
Content Type
Magazine Article
Language
English