Organic/Inorganic Coats for Packaging of Microelectronics

A method for protective packaging of multichip modules and related assemblies of microelectronic circuitry involves coating the assemblies with composite organic/inorganic layers only 1 to 2 mils (0.025 to 0.05 mm) thick. The method is suitable for a variety of advanced packages of microelectronic circuitry, including "chip-on-flex" circuitry, "smart" cards, flip-chips, flip-flips (flip-chips assembled onto ball-grid-array substrates), and such three-dimensional assemblies as stacked memory arrays.