Optical Surface Analysis Advances Defect Inspection of Optoelectronics
TBMG-6475
05/01/2006
- Content
Faced with increasing demand, manufacturers of power devices, microdisplays, and high-brightness light-emitting diodes (HB-LEDs) are focusing on tightening manufacturing process windows to reduce defects. The transparent nature of the substrates used to make many optoelectronic devices such as glass, silicon carbide, and sapphire makes manual defect inspection using optical microscopes an ambiguous and timeconsuming process incapable of highvolume production. To meet the need for improved defect inspection, Optical Surface Analyzer (OSA) instruments provide automated defect inspection for optoelectronic device wafers from 2" to 300 mm in diameter.
- Citation
- "Optical Surface Analysis Advances Defect Inspection of Optoelectronics," Mobility Engineering, May 1, 2006.