Can Nitrogen Mitigate Failures in Medical Device Manufacturing?

Manufacturers of medical devices must seek every way possible to eliminate failures of those devices. Many major failures result from a weakness in the solder joint that connects the wire bond to the printed circuit board (PCB) or the solder connecting the device or package to the board. Using nitrogen is not an absolute requirement. However, among other things, nitrogen can help to strengthen the bond and improve solder adhesion in the soldering process. This article explores the use of nitrogen and ways to minimize device failure.