New Tools & Technologies

ROHM Semiconductor (Kyoto, Japan) announced the addition of 14 new models to their PMDE package diodes, which reportedly provide superior heat-dissipation performance by expanding the backside electrode and optimizing the heat dissipation path. According to the company, this achieves the same electrical characteristics as those of conventional packages in a smaller size. Revisions to the backside electrode and heat dissipation path has allowed ROHM to achieve the same electrical characteristics in a smaller package, contributing to board miniaturization by reducing mounting area by approximately 42%. Mechanical strength is around 1.4 times higher than that of the SOD-123FL, reducing the risk of solder cracking when stress is applied to the board.

For more information, visit http://info.hotims.com/82340-400