New Study Showcases 3D Photonics with Record Performance for AI

TBMG-53013

05/01/2025

Abstract
Content

Artificial intelligence (AI) systems promise transformative advancements, yet their growth has been limited by energy inefficiencies and bottlenecks in data transfer. Researchers at Columbia Engineering have unveiled a groundbreaking solution: a 3D photonic-electronic platform that achieves unprecedented energy efficiency and bandwidth density, paving the way for next-generation AI hardware.

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Citation
"New Study Showcases 3D Photonics with Record Performance for AI," Mobility Engineering, May 1, 2025.
Additional Details
Publisher
Published
May 01
Product Code
TBMG-53013
Content Type
Magazine Article
Language
English