New 3D Chips Could Make Electronics Faster and More Energy-Efficient

25AERP09_10

09/01/2025

Abstract
Content

A new low-cost, scalable technology can seamlessly integrate high-speed gallium nitride transistors onto a standard silicon chip.

Massachusetts Institute of Technology, Cambridge, MA

The advanced semiconductor material gallium nitride will likely be key for the next generation of high-speed communication systems and the power electronics needed for state-of-the-art data centers.

Unfortunately, the high cost of gallium nitride (GaN) and the specialization required to incorporate this semiconductor material into conventional electronics have limited its use in commercial applications.

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Pages
3
Citation
. "New 3D Chips Could Make Electronics Faster and More Energy-Efficient," Mobility Engineering, September 1, 2025.
Additional Details
Publisher
Published
Sep 1, 2025
Product Code
25AERP09_10
Content Type
Magazine Article
Language
English