Multifunctional Platelet Composites for Tin Whisker Mitigation

To comply with the Restriction of Hazardous Substances (RoHS) directive, pure tin is replacing lead-tin alloys in commercial electronic devices. Unfortunately, tin can grow whiskers that can lead to electrical short circuits or metal vapor arcing, both of which threaten the long-term reliability of electronic systems, and cause critical systems to fail catastrophically. A current method of whisker mitigation utilizes coatings based on glassy or rubbery unfilled polymers; such coatings are not impenetrable to tin whiskers.