Mounting Flip Chips on Heat-Dissipating, Matched-CTE Boards
TBMG-3049
03/01/2002
- Content
“Flip chip on board (FCOB) with high thermal conductivity and tailored coefficient of thermal expansion (CTE)” denotes a developmental concept for relatively inexpensive, lightweight packaging of electronic circuits to accommodate high densities of components and of interconnections. The concept addresses several issues that pertain to flip-chip performance and reliability and to the integration of flip chips with other components: These issues include minimization of undesired mismatches of CTEs between flip chips and printed-wiring boards (PWBs), removal of heat from high-power flip chips, and the need to maximize stiffness while minimizing weight.
- Citation
- "Mounting Flip Chips on Heat-Dissipating, Matched-CTE Boards," Mobility Engineering, March 1, 2002.