Magazine Article

Mounting Flip Chips on Heat-Dissipating, Matched-CTE Boards

TBMG-3049

03/01/2002

Abstract
Content

“Flip chip on board (FCOB) with high thermal conductivity and tailored coefficient of thermal expansion (CTE)” denotes a developmental concept for relatively inexpensive, lightweight packaging of electronic circuits to accommodate high densities of components and of interconnections. The concept addresses several issues that pertain to flip-chip performance and reliability and to the integration of flip chips with other components: These issues include minimization of undesired mismatches of CTEs between flip chips and printed-wiring boards (PWBs), removal of heat from high-power flip chips, and the need to maximize stiffness while minimizing weight.

Meta TagsDetails
Citation
"Mounting Flip Chips on Heat-Dissipating, Matched-CTE Boards," Mobility Engineering, March 1, 2002.
Additional Details
Publisher
Published
Mar 1, 2002
Product Code
TBMG-3049
Content Type
Magazine Article
Language
English