Magazine Article

Micro-Textured Black Silicon Wick for Silicon Heat Pipe Array

TBMG-15862

03/01/2013

Abstract
Content

Planar, semiconductor heat arrays have been previously proposed and developed; however, this design makes use of a novel, microscale black silicon wick structure that provides increased capillary pumping pressure of the internal working fluid, resulting in increased effective thermal conductivity of the device, and also enables operation of the device in any orientation with respect to the gravity vector.

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Citation
"Micro-Textured Black Silicon Wick for Silicon Heat Pipe Array," Mobility Engineering, March 1, 2013.
Additional Details
Publisher
Published
Mar 1, 2013
Product Code
TBMG-15862
Content Type
Magazine Article
Language
English