Micro-Textured Black Silicon Wick for Silicon Heat Pipe Array
TBMG-15862
03/01/2013
- Content
Planar, semiconductor heat arrays have been previously proposed and developed; however, this design makes use of a novel, microscale black silicon wick structure that provides increased capillary pumping pressure of the internal working fluid, resulting in increased effective thermal conductivity of the device, and also enables operation of the device in any orientation with respect to the gravity vector.
- Citation
- "Micro-Textured Black Silicon Wick for Silicon Heat Pipe Array," Mobility Engineering, March 1, 2013.