Micro-Coil Spring Interconnection for Ceramic Grid Array Packaged Integrated Circuits

This method of interconnecting ceramic integrated circuits to organic printed circuit boards (PCBs) is designed to substantially increase the life of the interconnections. This is accomplished by providing a means of compensating for the shear stresses produced by thermal excursions as a result of the large mismatch of coefficients of thermal expansion between the integrated circuit and the printed circuit board.